Baoyan, L.; Danhui, H.; Wangxi, Z.
(Сверхтвердые материалы, 2018)
The Cu(Sn)–TiCx bonded diamond composites were prepared by in situ reaction sintering of Cu, Ti₂SnC and diamond powders. Effect of Ti₂SnC content on the phase composition, microstructure and grinding properties were studied.